Printed circuit board commonly used in the standard introduction

Printed circuit board commonly used in the standard introduction

Printed circuit board commonly used in the standard introduction 1) IPC-ESD-2020: Joint Criteria for Electrostatic Discharge Control Program Development. Including the design, build, implementation, and maintenance of the ESD control program. Based on the historical experience of certain military organizations and business organizations, guidance is provided for the handling and protection of ESD-sensitive periods. 2)…

What are the reasons for soldering blistering of circuit boards

What are the reasons for soldering blistering of circuit boards

What are the reasons for soldering blistering of circuit boards PCB circuit board soldering and blistering means that the circuit board is separated from the board or copper foil in a high temperature environment (above 250 °C), so that the solder resist and the flow blocking effect are lost. The occurrence of solder mask blistering…

Reasons for instability of PCB electroless nickel plating solution

Reasons for instability of PCB electroless nickel plating solution

Reasons for instability of PCB electroless nickel plating solution First, the reason for the instability of electroless nickel plating solution When the gas slowly releases the plating solution from the inside of the plating solution and starts to decompose by itself, the gas is not only released on the surface of the plating member, but…

How to produce FPC double-sided anti-oxidation board

How to produce FPC double-sided anti-oxidation board

How to produce FPC double-sided anti-oxidation board Select materials This is one of the main factors affecting the production of FPC flexible boards, so the materials selected will affect the entire circuit board production process. Cutting and drilling This is a step that every FPC board must go through. In addition to the manual cutting…

Printed circuit board manufacturing process

Printed circuit board manufacturing process

Single-sided PCB process flow: Blanking → screen printing → etching → removal of printing materials → hole processing → printing mark → coated flux → finished product. The process flow of multilayer printed boards: Inner Material Processing → Positioning Hole Machining → Surface Cleaning → Inner Layer Traces and Patterns → Corrosion → Laminate Pretreatment…

Five steps of PCB copying

Five steps of PCB copying

Five steps of PCB copying PCB copy board, under the premise that there are already electronic products and circuit boards, use the reverse technology to reversely analyze the circuit board, and carry out the technical documents such as the PCB file, bill of materials and schematic diagram of the original product. The restoration operation, and…